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2. STRETCHABLE ELECTRONICS

2.1 Stretchable interconnections

2.1.2 Substrates

Substrate is the bulkiest component in stretchable electronics and dominate how stretch-able the system is. The electronics itself can be rigid islands or flexible films, which are added over the stretchable substrate. Interconnections can be printed on the substrate us-ing stretchable inks, for which elongation and recovery is after all determined by sub-strate. Total stretchability and other mechanical and chemical properties of the substrate are essential for stretchable electronics because of the rest of the stretchable electronics is built over it. [3] [14]

All substrates that can deform elastically are not stretchable. Substrates such as some fabrics and plastics are classified as stretchable because they can elastically deform more

than few percent. Some substrates are not truly stretchable and are categorized as benda-ble substrates. [3] The stretchability is often determined with a tensile test and finally stress-strain curves, where parameters stress and strain are used:

𝜎 = 𝐹

𝐴 , (2)

where σ is the engineering (nominal) stress, F means force and A is the initial cross-sectional area of the sample. Strain can be estimated during tensile test as:

𝜀 =∆𝐿0

𝐿0 , (3)

where ε is the strain, L0 is original length of the sample and ΔL0 is the change in the sample’s length. [22] Plastics have different stress-strain behavior because of different relations between the stress and the strain components. Example curves are presented in Figure 3.

Figure 3. Stress-strain behavior of different plastics.

The behavior of plastics varies from brittle to hyper-elastic, which can be observed in stress-strain curves in Figure 3. Brittle plastic endure stress well but break fast at low strain. On the contrary, elastic plastics elongate tens of percent by a low amount of stress.

Generally, processable hard thermoset plastics are brittle and elastomers are highly elas-tic. Between brittle and non-linear stress-strain curves, there are irregular curves that in-dicate moderate non-linearity. Usually, multiple times processable thermoplastic poly-mers have a yield point, which is shown in more detail in Figure 4.

Figure 4. Typical stress-strain curve of thermoplastic polymer.

In Figure 4, there is a typical engineering stress-strain curve of thermoplastic polymer.

The curve shows some specific points during a tensile test; elastic limit, yield point, ulti-mate strength and breakpoint. At small strains the plastic has linear elasticity and behaves elastically until the elastic limit. After the elastic limit elastic deformation changes to plastic deformation and covers the yield point. Definition of the elastic limit and yield point vary and in some cases they can be understood to be the same. Elastic deformation is reversible and the plastic deformation is irreversible, which is the reason why a stretch-able substrate should be linear or non-linear elastic. [3] [22] [23] Tensile modulus (Young’s modulus) and Poisson’s ratio are used to describe elasticity of plastic:

𝐸 =∆𝜎

∆𝜀 , (4)

where E is the tensile modulus, Δσ is the elastic change of the stress and Δε is the change of the strain along linear portion [22] [23]. Generally, plastics have high strain at low stress values and, hence, low tensile modulus [3]. Poisson’s ratio is defined the following way:

𝜇 = −∆𝜀𝑛

∆𝜀𝑙 , (5)

where µ is the Poisson’s ratio, Δεn is a change of strain in a selected perpendicular direc-tion and Δεl is an increase of strain in a selected longitudinal direction. Poisson’s ratio of elastomers is around 0,5, which means that perpendicular dimension can change half amount of the increase in the longitudinal direction. [22] [24] In some stretchable elec-tronics applications, the Poisson’s effect during stretching can decrease the resistance of

interconnections by improving electrical contacts inside the interconnections in the lateral direction directions. [13]

After reaching the yield point. plastics have plastic deformation. Thermoplastic plastic undergoes neck formation and cold drawing, where structure of plastic is thinned and elongated. The first elongation phase is followed by strain hardening that strengthen the plastic. Due to the deformation, plastic reaches ultimate strength point, where it reaches the maximum amount of stress. Later on after the ultimate strength point the plastic quickly fails at breakpoint. [22] [23] [25]

Substrates are made from various plastics, for example polyvinyl chloride, polyimide, polydimethylsiloxane, and thermoplastic polyurethane (TPU) are used [4] [13]. The cho-sen substrate in the thesis is highly stretchable TPU-film Platilon U 4201 AU by Epurex Films. Generally, TPU films are heat laminable, biocompatible and cost-effective. Be-cause of their properties, TPU substrates are widely used in stretchable electronics stud-ies. Furthermore, TPU film is already used in the traditional textile industry in the manu-facturing of wet proof clothing. [5] [6] [20]

Chemically, TPU is categorized as copolymer. It is composed of alternating hard and soft segments for which the ratio defines how rigid or flexible the film is. The hard crystalline segments are achieved by urethane linkages between di-isocyanates and diols or diamine chain extenders. The soft amorphous segments are opposite and are diols. For instance, ester or ether diols are often used, which affects mechanical properties of a film. For instance, diols with ether groups are used for elastic TPU films. [26] [27]

The film Platilon U 4201 AU by Epurex Films is blow-molded ether grade TPU-film that has excellent hydrolysis resistance and thermoformability. Its thickness is 100 µm and it does not contains plasticizers. Further properties of the substrate are shown in Table 3:

Table 3. Properties of TPU-film Platilon U 4201 AU [28].

Density (g/cm3) 1,15

Softening Range (°C) 155-185

Hardness (Shore A) 87

Tensile Stress at Break (MPa) 60

Tensile Stress at 50 % Strain (MPa) 5-7

Tensile Strain at Break (%) 550

The TPU-film has relative high softening range, which makes it compatible with conduc-tive ink CI-1036. The film has higher softening range than the curing temperature of the ink. Also, the film can elongate even 550 % before break, which ensures that the film does not limit the stretchability of printed patterns. [28]